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guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.

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City:dongguan

Province/State:guangdong

Country/Region:china

Contact Person:MrLeonard

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Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + UPW Rinsing, 60℃

Name: Semiconductor Silicon Wafer Cleaner 40KHz80KHz Ultrasonic AlkalineAcid Cleaning UPW Rinsing 60
Brand: Jietai
Price: 800000 USD

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Brand Name :Jietai

Model Number :JTM-100504AD

Certification :CE, FCC, ROHS, etc.

Place of Origin :Dongguan, Guangdong

MOQ :1

Price :￥800000

Payment Terms :T/T

Supply Ability :One unit. It will take 30 to 60 days.

Delivery Time :30-60work days

Packaging Details :Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M

Type :Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing

Name :Semiconductor Cleaning Machine

Model :JTM-100504AD

Overall Dimensions :12M*2M*2.8M

Cleaning Frequency :40KHZ/80KHZ

Power :120KW

Cleaning temperature :60℃

Number of Tanks :10

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Product Introduction: Semiconductor Silicon Wafer Cleaner

A precision-engineered solution for semiconductor manufacturing, this ultrasonic cleaning system integrates multi-stage processes to achieve sub-micron level surface purity on silicon wafers—critical for maintaining device performance in advanced node fabrication (down to 5nm).

Sequential Cleaning Stages:

Ultrasonic Alkaline Scrubbing: Employs 40KHz-80KHz ultrasonic cavitation in alkaline bath to decompose organic contaminants, strip photoresist residuals, and dislodge macro-particles (≥1μm) from wafer surfaces and via structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafer diameters, including edge exclusion zones.

Ultrasonic Acid Etching: Utilizes the same frequency range in acidic media to dissolve inorganic impurities—specifically metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂). Cavitation micro-jets penetrate patterned features to remove embedded sub-100nm contaminants, validated by particle counter readings (≤10 particles/wafer for ≥0.1μm).

UPW Rinsing: Final rinse with ultra-pure water (UPW, TOC ≤5ppb) flushes residual chemistries, achieving surface resistivity ≥18.2MΩ·cm—meeting SEMI F20 standards for pre-deposition cleaning.

Process Parameters:

Frequency Band: 40KHz-80KHz (multi-frequency operation, selectable via HMI for contamination-specific tuning)

Temperature Setpoint: 60℃ (PID-controlled, ±1℃ tolerance) to optimize chemical reaction kinetics without inducing wafer warpage.

Material Compatibility: Wetted components in PFA (perfluoroalkoxy) and sapphire to prevent metallic ion leaching, ensuring zero cross-contamination.

Fab Integration Advantages:

Compatible with FOUP/SMIF pod loading for automated cassette handling, reducing human intervention

Cleanroom-class design (ISO 5) with HEPA-filtered exhaust to maintain Class 1 environment compliance

Recipe storage for 50+ cleaning protocols, adaptable to bare wafers, SOI wafers, and epi-wafers

Application: Essential for pre-litho, post-CMP, and post-etch cleaning in logic, memory, and MEMS fabrication lines.

Keywords: Semiconductor wafer ultrasonic cleaner, alkaline-acid sequential cleaning, UPW rinsing, 40-80KHz, 60℃ process, sub-micron decontamination

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