Product Introduction: Semiconductor Silicon Wafer Cleaner
Engineered specifically for semiconductor manufacturing, this precision cleaning system integrates multi-stage ultrasonic processes to meet the stringent surface purity requirements of silicon wafers, ensuring minimal particle contamination and residual removal critical for wafer fabrication.
Core Cleaning Processes:
- Ultrasonic Alkaline Cleaning: Utilizes alkaline chemistry combined with ultrasonic energy to effectively remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces, preparing substrates for subsequent processing.
- Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxides) through acid-based ultrasonic treatment, leveraging cavitation effects to dislodge submicron contaminants embedded in wafer textures or patterned structures.
- DI Water Rinsing: Final stage employs high-purity deionized water for thorough rinsing, eliminating residual cleaning agents and ensuring surface neutrality, a prerequisite for post-cleaning wafer handling and processing.
Technical Specifications:
- Ultrasonic Frequency: 40KHz-80KHz (multi-frequency adjustable, optimizing cavitation intensity for different contamination types)
- Operating Temperature: 60℃ (precision-controlled thermal environment to enhance chemical reactivity and cleaning efficiency)
- Material Compatibility: Constructed with PVDF, quartz, and 316L stainless steel components to resist corrosive chemistries and prevent secondary contamination.
Key Advantages:
- Achieves sub-10nm particle removal efficiency, compliant with SEMI standards for advanced wafer processing
- Multi-frequency ultrasonic configuration adapts to diverse cleaning requirements (from bare wafer to patterned wafer stages)
- Closed-loop temperature control ensures process repeatability, critical for batch-to-batch consistency
- Integrates seamlessly into semiconductor front-end and back-end manufacturing lines
Application: Ideal for cleaning silicon wafers in IC manufacturing, MEMS fabrication, and semiconductor packaging processes, where surface integrity directly impacts device performance and yield.
Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, DI water rinsing, 40-80KHz, 60℃ temperature control, silicon wafer processing
